The customer requires a new soldering process to replace manual positioning and oven-welding. Copper Top-pin or Pack-pin covered with a silver-tin alloy must be soldered on a DBC substrates (Direct Bond Copper), composed of a ceramic insulator, Al2O3 onto which pure copper metal is attached by a high temperature eutectic melting process and thus tightly and firmly joined to the ceramic. DBC High thermal conductivity prevents any contact based soldering techniques.

Datalogic’s KUBO 100 laser welding system can quickly and easily solder the pins because the high peck power overcomes the thermal conductivity effects.

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