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Violino™ U.V.
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High performances for material processing demanding applications.
Diode-pumped laser sources.
Violino™ U.V. , manufactured with an extensive experience and success of Violino™ DPSS family, is based on the mechanic optical architecture of Third Harmonic Generation (THG) INTRACAVITY technology.
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The INTRACAVITY technology allows a very extensive life of the LBO non-linear crystal. Together with high beam quality and its axial symmetry, thus is ideal to be used for applications which need a short wavelength (355nm).
The U.V. 355nm wavelength causes much less mechanical distortion and much less heat affected zone (HAZ) in comparison with the I.R. laser radiation.
Its high average power and repetition rate allow to cut complex shapes in silicon wafer and in fast scribing of glass.
As per the Violino™ laser family this U.V. laser is air cooled and can be easily integrated in production line. High performances of this Laser source allow its use in demanding material process applications.
Violino U.V. Gallery
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Wafer dicing - silicon - electronic applications |
Colour change - cellulose - medical applications |
Plastic |
Technical Specifications
| Laser Model |
Violino™ U.V. |
| Laser Medium / Wavelength |
L.B.O. / 355 nm |
| Nominal Power |
3W ± 5% (@ laser aperture) |
| Beam Quality |
M² < 1.5 |
| Power Stability (8h) |
< 1.5% rms (power mode) |
| Pulse width |
12 ns (@ 20KHz) |
| Pulse energy / Peak Power |
Max.125µJ / 10KW |
| Frequency |
20 - 100 KHz |
| Maintenance intervals (MTBM) |
10,000 hours |
| Aiming Beam |
Class 2M Red Diode Laser; λ = 635 ± 5nm; 3 mW |
| Power supply |
AC 90-240 V / 50-60 Hz / 700 W |
| Cooling (TEC ait cooled) |
Heat load 240W (818btu/ h) |
| Operating temperature |
+10 to +35 °C (46 to 95 °F) |
 To download brochure CLICK HERE
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