Photonics Industries DM
High-power green and UV multimode nanosecond lasers
- Up to 200 W average power (400 W in Dual Head configurations)
- Proprietary Twin Pulse mode with programmable energy ratios
- Versatile pulse widths including extended 300 ns Long Pulse versions
- Field-proven reliability with under 1% service call rates
- Integrated laser head with built-in driver electronics
- Rapid start-up in under 10 minutes from cold start
- Software-controlled automated beam alignment for Dual Head models
Since 2002, Photonics Industries has pioneered multimode performance with the DM Series, setting industry standards for high-energy and high-power operation. These diode-pumped, Q-switched lasers are engineered into a compact, industrial-grade platform suitable for both 24/7 manufacturing and advanced research environments.
The DM Series delivers unmatched versatility, offering high pulse energies of up to 200 mJ and power levels reaching 400 W. It is available across multiple wavelengths, including 532 nm (Nd:YAG), 527 nm (Nd:YLF), and 351 nm (Nd:YLF), to meet a wide range of requirements.
System performance is underpinned by outstanding pulse-to-pulse stability and a highly integrated design that eliminates performance loss over long umbilicals. The laser head features built-in driver electronics, while the entire system is managed via a user-friendly software GUI over RS232 or Ethernet. Furthermore, the power supply is consolidated into an ultra-compact 2U rack-mounted unit.
Reliability is a cornerstone of the DM Series, evidenced by a field-proven service call rate of less than 1% during warranty periods. Intelligent features such as Dynamic Pulse Energy Control (PEC), power monitoring, and auto-attenuation ensure that a precise pulse energy is maintained throughout the laser’s life. This robustness makes the series an ideal choice for demanding industrial applications like laser shock peening, water-jet assisted cutting, and semiconductor processing.
For users requiring maximum throughput, Dual Head models utilise two fully independent resonators within a single unit to double the power and energy output. This configuration is further enhanced by patented Twin Pulse mode, which generates pulse pairs from a single trigger. This mode allows for user-programmable energy splitting and pulse separation down to 1 µs from a single head, or even sub-microsecond timing in Dual Head mode.
A significant advancement in the range is the DM Long Pulse (LP) Series, which features pulse widths extended up to 300 ns. This extension is critical for applications requiring longer thermal interaction times, such as polymer welding, thermal annealing of thin films, and nanoparticle sintering.
The DM Series continues to lead the market in efficiency and space-saving design, providing a simple yet rugged form factor for complex tasks. Whether pumping Ti:Sapphire amplifiers, powering high-speed PIV systems or processing materials, these systems provide the advanced performance required.
If you have an application where you think a Photonics Industries DM laser may be your solution, please contact us.
| Model | Wavelength | Power | Pulse Energy | Pulsewidth |
| DM Nd:YAG Single Head Series | ||||
| DM1-532-200 | 532 nm | 200 W at 10 kHz | 20 mJ at 10 kHz | 150 ns at 10 kHz |
| DM1-532-150 | 150 W at 10 kHz | 15 mJ at 10 kHz | 75 ns at 10 kHz | |
| DM1-532-100 | 100 W at 10 kHz | 10 mJ at 10 kHz | 70 ns at 10 kHz | |
| DM1-532-60 | 60 W at 10 kHz | 6 mJ at 10 kHz | 65 ns at 10 kHz | |
| DM Nd:YAG Dual Head Series | ||||
| DM2-532-200 | 532 nm | 400 W at 10 kHz | 40 mJ at 10 kHz | 150 ns at 10 kHz |
| DM2-532-150 | 300 W at 10 kHz | 30 mJ at 10 kHz | 75 ns at 10 kHz | |
| DM2-532-100 | 200 W at 10 kHz | 20 mJ at 10 kHz | 70 ns at 10 kHz | |
| DM2-532-60 | 120 W at 10 kHz | 12 mJ at 10 kHz | 65 ns at 10 kHz | |
| DM Nd:YAG LP Single Head Series | ||||
| DM1-532-200-LP | 532 nm | 200 W at 10 kHz | 20 mJ at 10 kHz | 150 ns at 10 kHz |
| DM1-532-150-LP | 150 W at 10 kHz | 15 mJ at 10 kHz | 150 ns at 10 kHz | |
| DM1-532-100-LP | 100 W at 10 kHz | 10 mJ at 10 kHz | 300 ns at 10 kHz | |
| DM1-532-60-LP | 60 W at 10 kHz | 6 mJ at 10 kHz | 200 ns at 10 kHz | |
| DM Nd:YAG LP Dual Head Series | ||||
| DM2-532-200-LP | 532 nm | 400 W at 10 kHz | 40 mJ at 10 kHz | 150 ns at 10 kHz |
| DM2-532-150-LP | 300 W at 10 kHz | 30 mJ at 10 kHz | 150 ns at 10 kHz | |
| DM2-532-100-LP | 200 W at 10 kHz | 20 mJ at 10 kHz | 300 ns at 10 kHz | |
| DM2-532-60-LP | 120 W at 10 kHz | 12 mJ at 10 kHz | 200 ns at 10 kHz | |
| DM UV Series | ||||
| DM-351-60 | 351 nm | 100 W at 3 kHz | 60 mJ at 1 kHz | 100 ns at 1 kHz |
| DM-351-30 | 45 W at 3 kHz | 30 mJ at 1 kHz | 100 ns at 1 kHz | |
| DM-351-20 | 30 W at 3 kHz | 20 mJ at 1 kHz | 100 ns at 1 kHz | |
| DM UV Dual Head Series | ||||
| DM2-351-60 | 351 nm | 200 W at 3 kHz | 120 mJ at 1 kHz | 100 ns at 1 kHz |
| DM2-351-30 | 90 W at 3 kHz | 60 mJ at 1 kHz | 100 ns at 1 kHz | |
| DM2-351-20 | 60 W at 3 kHz | 40 mJ at 1 kHz | 100 ns at 1 kHz | |
| DM Nd:YLF Single Head Series | ||||
| DM1-527-150 | 527 nm | 150 W at 3 kHz | 100 mJ at 1 kHz | 180 ns at 1 kHz |
| DM1-527-90 | 90 W at 3 kHz | 60 mJ at 1 kHz | 170 ns at 1 kHz | |
| DM1-527-75 | 75 W at 3 kHz | 50 mJ at 1 kHz | 140 ns at 1 kHz | |
| DM1-527-60 | 60 W at 3 kHz | 40 mJ at 1 kHz | 120 ns at 1 kHz | |
| DM1-527-45 | 45 W at 3 kHz | 30 mJ at 1 kHz | 110 ns at 1 kHz | |
| DM1-527-30 | 30 W at 3 kHz | 20 mJ at 1 kHz | 100 ns at 1 kHz | |
| DM Nd:YLF Dual Head Series | ||||
| DM2-527-150 | 527 nm | 300 W at 3 kHz | 200 mJ at 1 kHz | 180 ns at 1 kHz |
| DM2-527-90 | 180 W at 3 kHz | 120 mJ at 1 kHz | 170 ns at 1 kHz | |
| DM2-527-75 | 150 W at 3 kHz | 100 mJ at 1 kHz | 140 ns at 1 kHz | |
| DM2-527-60 | 120 W at 3 kHz | 80 mJ at 1 kHz | 120 ns at 1 kHz | |
| DM2-527-45 | 90 W at 3 kHz | 60 mJ at 1 kHz | 110 ns at 1 kHz | |
| DM2-527-30 | 60 W at 3 kHz | 40 mJ at 1 kHz | 100 ns at 1 kHz |
Particle Image Velocimetry (PIV)
Pumping Ti:Sapphire Ultrafast Amplifier Systems
Laser Shock Peening
Laser Thermal Processing (LTP)
Semiconductor Lithography
Surface Cleaning and Ablation
Water-Jet Assisted Laser Cutting
Diamond Cutting
Precision Layer Removal for Additive Manufacturing